PLIOGRIP® Epoxy Systems for Laminating Applications
System Applications
PLIOGRIP® PER 526/ PH 110/ PH 609 Low viscosity hot curing solvent free system. Used for G-11 laminates
PLIOGRIP® PER 526/PH 972 General purpose laminating system with good electrical and mechanical properties with high HDT
PLIOGRIP® PER 526/PH 977 Offers easy mixing & longer potlife at room temperature. Used in laminates, smaller castings & pultrusions
PLIOGRIP® PER 526/PH 972 OR PER 524/ PH 906 / PH 270  Laminating systems for pultrusion
PLIOGRIP® PER 526/ PH 665 Offers easy mixing & longer potlife at room temperature. Used in laminates, smaller castings & pultrusions
PLIOGRIP® PER 238/ PH 609  For Mica Tapes manufacturing
PLIOGRIP® PER 552/ PH 552 Low viscosity, solvent free epoxy laminating system for glass, aramid, carbon fiber by hand lay-up resin transfer moulding, press moulding and filament winding systems. Good mechanical strength both static and dynamic.
PLIOGRIP® PER 255/ PH 110 Laminating system for Boat building applications
PLIOGRIP® PER 235/--> PH 633 Laminates offer excellent dynamic mechanical properties. Suitable for hand lay-up match die moulding vacuum, bag mold etc. can be used for sport goods, auto components, gliders, windmill blades etc