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PLIOGRIP® Epoxy
Systems for Laminating Applications |
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System |
Applications |
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PLIOGRIP®
PER 526/ PH 110/ PH 609 |
Low viscosity hot curing solvent free system. Used for G-11
laminates |
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PLIOGRIP®
PER 526/PH 972 |
General purpose laminating system with good electrical and
mechanical properties with high HDT |
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PLIOGRIP®
PER 526/PH 977 |
Offers easy mixing & longer potlife at room temperature.
Used in laminates, smaller castings & pultrusions |
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PLIOGRIP® PER
526/PH 972 OR PER 524/ PH 906 / PH 270 |
Laminating systems for pultrusion |
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PLIOGRIP®
PER 526/ PH 665 |
Offers easy mixing & longer potlife at room temperature.
Used in laminates, smaller castings & pultrusions |
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PLIOGRIP® PER 238/ PH 609 |
For Mica Tapes manufacturing |
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PLIOGRIP®
PER 552/ PH 552 |
Low viscosity, solvent free epoxy laminating system for glass,
aramid, carbon fiber by hand lay-up resin transfer moulding, press moulding
and filament winding systems. Good mechanical strength both static and
dynamic. |
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PLIOGRIP®
PER 255/ PH 110 |
Laminating system for Boat building applications |
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PLIOGRIP® PER 235/--> PH 633 |
Laminates
offer excellent dynamic mechanical properties. Suitable for hand lay-up match
die moulding vacuum, bag mold etc. can be used for sport goods, auto
components, gliders, windmill blades etc |
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